Alkaline addition to palladium agent (PDJ-A)
Prior to treatment | After PDJ-A treatment |
L/S=200/230 |
Fill hole plated copper brightener of plated through hole (OKUNO TOP LUCINA THF)
Aperture: 0.1mm Hole depth: 0.2mm Plating conditions: PPR+ Insoluble anode |
Aperture: 0.1mm Hole depth: 0.4mm Plating conditions: PPR+ Insoluble anode |
Fill hole plated copper brightener of build hole (OKUNO TOP LUCINA New NSV)
Plating thickness: 10μm Aperture: 60μm Hole depth: 30μm Copper sulfate 100g/L Sulfuric acid 180g/L Electric current density: 1.0A/dm2 |
● Chemicals of electroless nickel palladium (OKUNO NPG Process)
● Low stress ENIG (ICP Nicoron FPF for flexible board)
● Chemical nickel of ceramic substrates (NNP Process for LTCC board)
● Arlon Ultra silicon press Pads
● Du Pont Teflon release films
● The Bergquist Company MCPCBs